Embedded solid-state battery

ABSTRACT

Elements of an electrochemical cell using an end to end process. The method includes depositing a planarization layer, which manufactures embedded conductors of said cell, allowing a deposited termination of optimized electrical performance and energy density. The present invention covers the technique of embedding the conductors and active layers in a planarized matrix of PML or other material, cutting them into discrete batteries, etching the planarization material to expose the current collectors and terminating them in a post vacuum deposition step.

REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/653,366, filed Oct. 16, 2012, the entire contents of which areincorporated herein by reference. The present invention is related toand incorporates by reference, for all purposes, the following U.S. Pat.No. 7,945,344 and U.S. Patent Publication Nos. 2009-0325063;2012-0058380; 2012-0055633; and 2012-0058280; and U.S. patentapplication Ser. No. 13/407,609.

BACKGROUND OF THE INVENTION

This present invention relates to manufacture of electrochemical cells.More particularly, the present invention provides a process and methodfor manufacturing a solid-state thin film battery device. Merely by wayof example, the invention has been described with the use of lithiumbased cells, but it is recognized that other materials such as zinc,silver, copper, cobalt, iron, manganese, magnesium and nickel could bedesigned in the same or like fashion. Additionally, such batteries canbe used for a variety of applications such as portable electronics (cellphones, personal digital assistants, music players, video cameras, andthe like), power tools, power supplies for military use (communications,lighting, imaging and the like), power supplies for aerospaceapplications (power for satellites), and power supplies for vehicleapplications (hybrid electric vehicles, plug-in hybrid electricvehicles, and fully electric vehicles). The design of such batteries isalso applicable to cases in which the battery is not the only powersupply in the system, and additional power is provided by a fuel cell,other battery, IC engine or other combustion device, capacitor, solarcell, etc.

BRIEF SUMMARY OF THE INVENTION

According to the present invention, a method related to the manufactureof electrochemical cells is provided. More particularly, the presentinvention provides a method of manufacturing a solid-state thin filmbattery device. Merely by way of example, the invention has beenprovided with use of lithium-based cells, but it would be recognizedthat other materials described above, could be designed in the same orlike fashion. Additionally, such batteries can be used for a variety ofapplications such as portable electronics (cell phones, personal digitalassistants, music players, video cameras, and the like), power tools,power supplies for military use (communications, lighting, imaging andthe like), power supplies for aerospace applications (power forsatellites), and power supplies for vehicle applications (hybridelectric vehicles, plug-in hybrid electric vehicles, and fully electricvehicles). The design of such batteries is also applicable to cases inwhich the battery is not the only power supply in the system, andadditional power is provided by a fuel cell, other battery, IC engine orother combustion device, capacitor, solar cell, etc.

In a specific embodiment, the present invention provides a procedure forthe formation of one or more elements of an electrochemical cell using acomplete process.

Benefits are achieved over conventional techniques. Depending upon thespecific embodiment, one or more of these benefits may be achieved. In apreferred embodiment, the present invention provides a process forcomplete deposition of all electrochemical cell materials, includinganode, cathode, electrolyte, barriers, stress modifying layers, andembedded current collectors, including combinations thereof.

In particular, it is the ability afforded by this invention tomanufacture electrochemical cells without handling individual layerswhich gives the added benefit of embedded current collectors, allows theformation of a robust product while minimizing parasitic losses ofnon-energy producing layers and increasing yield due to handling andparticulate issues. Specific benefits seen over the conventional artinclude:

-   -   a) The ability to utilize extremely thin layers without        subjecting them to stresses and high aspect ratio surface        features, such as rollers, in a roll-to-roll continuous process.    -   b) The ability to manufacture large numbers of stacked battery        cells in strip form, allowing for battery capacity to be later        determined by the length of the battery cut from the strip.    -   c) The ability to deposit a smoothing and/or insulating layer        between stacked cells of a material, which exhibits a very high        etching contrast ratio. This allows the embedded current        collectors to be exposed and electrically terminated without        physical contact, thus significantly reducing damage and        increasing yield.    -   d) The ability to terminate current collectors both very close        together (<0.5 microns) to very far apart (>5 mm) in a single        operation.    -   e) The ability to utilize the termination itself for adhesion to        the battery, and not add any stress to the current collectors,        thus improving performance and yield.    -   f) The ability to optimize the volume and mass of the        terminations and gain the maximum energy density per battery.        This is particularly true in batteries that are small as would        be used in electronic communications and handheld devices.    -   g) The ability to optimize the margin, as defined as the        distance between anode and cathode layers and current collectors        in plane, by a post deposition process and not burden the        manufacturing process with extreme tolerance positioning of        layers. This is especially true for batteries with a high number        of layers and relatively thick total height.    -   h) The ability to make extremely low impedance connection to        very thin current collectors due to the vacuum deposited nature        of the termination process and the ability to connect to the        entire length of the current collector.    -   i) The ability to tailor the materials of the termination to        have components that provide adhesion, low electrical impedance,        robustness, solderability, weldability, and the like.    -   j) The ability to utilize an insitu ablation process, such as        laser, brush, ion beam, wheel, roller, scraper, and the like in        place of a shadow mask to delineate conductors and or other        layers of the electrochemical device.

It is further understood that the method itself may be a combination ofmethods and may affect the electrochemical properties of the thin film,and may be the cause of significant improvements in ionic conductivity,electrical resistivity, contact resistance, and the like; all of whichare incorporated herein.

Depending upon the specific embodiment, one or more of these benefitsmay be achieved. Of course, there can be other variations,modifications, and alternatives.

The present invention achieves these benefits and others in the contextof unique and non-intuitive process technology. However, a furtherunderstanding of the nature and advantages of the present invention maybe realized by reference to the latter portions of the specification andattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following diagrams are merely examples, which should not undulylimit the scope of the claims herein. One of ordinary skill in the artwould recognize many other variations, modifications, and alternatives.It is also understood that the examples and embodiments described hereinare for illustrative purposes only and that various modifications orchanges in light thereof will be suggested to persons skilled in the artand are to be included within the spirit and purview of this process andscope of the appended claims.

FIG. 1 is a cross-section of an electrochemical cell;

FIG. 2 is a drawing showing removal a portion of the deposited materialat the edge of the layer;

FIG. 3 is a schematic showing a cross-section of an electrochemical cellin which portions of the layers have been removed to facilitatetermination;

FIG. 4 is a cross-section of an electrochemical cell depicting thecutting of an electrochemical cell into smaller strips;

FIG. 5 is a cross-section of an electrochemical cell with a smoothinglayer deposited over the edge;

FIG. 6 is a drawing of a strap of embedded electrochemical cells;

FIG. 7 is a scanning electron microscope image of the cross-section of amultilayer cell; and

FIG. 8 is an apparatus for manufacturing the embedded solid-statebattery device.

FIG. 9 is a simplified flow diagram illustrating a method according toan embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Lithium ion batteries must occupy substantial three-dimensional volumesto be useful. By way of example, those used in the Apple iPhone 4® andthe GM Volt® achieve this usefulness by being deposited on a web orflexible substrate and stacked or wound with separator webs and currentcollector webs to form a size and electrical performance suitable foruse. The wound or stacked devices are then terminated by a number ofmeans, all of which use an excess of space and weight to compensate forsmall area electrical connections due to manufacturing problemsassociated with termination along the entire length of the currentcollectors.

As for solid-state technology, those in the field have attempted tobuild multi-layer, or stacked solid-state batteries, deposited one uponthe other, but have been limited to only a single layer of cells due tomanufacturing problems. These manufacturing problems include thedifficulties of building multiple stacks one upon the other withouttransmitting defects and systematically increasing the roughness oflayers or stress in the layers. Another inherent problem is thetermination of a large number of opposite polarity, extremely thincurrent collectors in a minimum space with minimum weight and with therobustness required for commercial applications. The thin film batteriesthus far produced are severely limited in energy and usefulness, and arenot readily scalable.

Those skilled in the art have been unable to manufacture thin filmsolid-state batteries useful in replacing conventional technology,particularly those batteries for extended use in consumer electronics orin automobiles.

One of the advantages of thin film solid-state batteries is theirability to be manufactured in precision sufficient to allow largenumbers of parallel cells to form higher energy density devices withoutthe detrimental effects often seen in conventional technology. Thesedetrimental effects include: breakdown of the liquid dielectric, growthof films at the anode and cathode interface to the dielectric, dendritegrowth of the anode materials, spot heating at particles and shorting.As noted above, the physics of the conventional state of inorganicmaterials useful in solid-state batteries overcomes almost all of thesedetrimental effects except for the very thin layers required to operateat charge and discharge rates that are useful. This, in turn, leads tovast numbers of these very thin cells being connected in parallel.Furthermore, the subsequent manufacturing requirements of terminatingthis high number of current collectors, whose thicknesses can be in therange of 100 to about 5000 Angstroms, onto terminals that can carry 10'sof amps are extremely difficult. These very thin layers play animportant role in the superior energy density of solid-state batteries,as the volume and mass they contribute is very minor; however, this samebenefit represents a major manufacturing problem due to their delicatenature. Added to these issues is the need for extreme robustness bothphysically and electrically, and the not insubstantial requirement tominimize the mass and size of the terminations. The conventional stateof the art utilizes shaped current collectors ending in tabs, whichcontact only a portion of the width of the current collector. This canhave serious deleterious effects on the interface impedance between thecurrent collector and the termination. In fact, a substantial number ofbattery pack failures have been traced to poor terminations.

Another manufacturing problem with solid-state batteries is the glass orceramic nature of the cathode and electrolyte. These films are thin andbrittle having little strength, especially in tension. Submicron sizeddefects, especially in the electrolyte layer, can cause performancedegradation or complete failure. Consequently, handling of these layersof thin films presents great challenges in product quality.

Further, in order to realize the true high energy density potential ofsolid-state batteries, little volume and mass can be given over to thetype of bulky terminations and packaging used in present commercialbatteries. What works for conventional wet technology does not makeeconomic sense for solid-state.

Therefore, when designing a product and process for the manufacture ofsolid-state batteries, one must include all aspects of what is inside ofthe package, how the cell itself is shaped and how it is terminated.This is especially true of multilayer stacks of thin films with multipledifferent materials and high numbers of layers. This invention relatesto a non-intuitive process of manufacturing robust multilayerelectrochemical cells.

Referring to U.S. Pat. No. 7,945,344 and U.S. Patent Publication Nos.2009-0325063; 2012-0058380; 2012-0055633; and 2012-0058280; and U.S.patent application Ser. No. 13/407,609, all assigned to Sakti3, Inc.,and incorporated by reference herein, we teach that the optimum designfor energy density includes electrochemical cells with multiplerepeating layers, thin current collectors, strategically placedsmoothing layers and monolithic embedded terminations.

According to the present invention, methods related to the manufactureof electrochemical cells are provided.

One element of the invention relates to the ability to planarize thecross-section of the battery itself, compensating for the difference instep height caused by margins (as defined above and created by maskingor by removal).

A further element of the invention pertains to the ability to protectboth layers and terminations from physical damage during themanufacturing process; this is the direct and inherent benefit ofencapsulating all layers into a monolithic design.

A further element of the invention pertains to the ability to utilizemultiple deposition sources for the simultaneous deposition ormanufacturing of layers, thus significantly decreasing the manufacturingtime, output per capital dollar invested, and cycle time per batch.

Yet a further element of the invention results in the ability tomanufacture stacked solid-state batteries, in numbers greater than 1000,without touching the layers.

A further element of the invention, made possible by the above feature,is the ability to optimize energy density by controlling the parasiticvolume and mass associated with margins, terminations, and substrates.

A unique element of the invention is the non-intuitive ability tomanufacture a complete multi-layer solid-state battery in a singleoperation and vacuum step, thus significantly reducing the manufacturingcost and increasing the product quality and yield.

Yet another novel element of the invention is the ability to depositmultiple strips of batteries of different widths and lengths thuscreating finished batteries suitable for multiple customers and purposesin a single machine cycle. Further, it is a unique ability to easilychange process adjustment or subcomponents and optimize manufacturingparameters for individual product needs.

Examples enabled by the invention include, but are not limited to,varying the amounts of cathode to anode material throughout thethickness of a combination or multi-deposited depleted cathode layers,graded index or modulus films for the control and tailoring of stress ortemperature and the control of their gradients.

As further described and illustrated in FIG. 1, the elemental stepsprovided by this invention are as follows. Referring to FIG. 1,describing a preferred embodiment of the invention particularly uniqueand useful for the manufacture of electrochemical cells. FIG. 1 is across-section of an electrochemical cell depicting several keycomponents of this invention.

Item 23 refers to the cathode current collector layer, item 25 refers tothe cathode layer, item 27 refers to the electrolyte layer, and item 21refers to the anode layer. Variations of this arrangement may include ananode current collector layer disposed directly on top of the anodelayer shown, coating an anode or a cathode on both sides of theirrespective current collectors, with or without an intermediate layer.

Items 21 and 23, again depicting the anode and cathode currentcollectors respectively, are shown to protrude from the stack of layersin general. Notice item 31, which is symmetrical on both sides of theelectrochemical stack. This item is the termination which connects inparallel all protruding anode and all protruding cathode currentcollector layers into a low impedance construct allowing directconnection to the electrochemical cell by spring loaded contact,soldering, welding, conductive materials, and the like.

Paying particular attention to item 29 we illustrate the smoothing andinsulating layer described in detail above. It is noted that the etchingcontrast of this material against the anode and cathode currentcollector is very high in the presence of plasma-assisted or chemicaletching.

In another preferred embodiment, as depicted in FIG. 2, item 29 in FIG.1 above would not be necessary if the alternating margins of the anodeand cathode layers are produced by removal.

As shown in FIG. 2, item 86 depicts the belt or drum of the depositiontool described herein. On that belt or drum are coated multiple layersof electrochemical materials forming the product. Here it can be seenthat items 81 and 83 refer to the belt or drum or underlying layerswhere a portion of a layer 87 and 89 respectively are removed, as bylaser ablation or other methods described above.

This embodiment has several advantages over shadow masking and fillingas described in FIG. 1. Among these advantages are: ability to produce asharp and precise edge not effected by the mean free path of thedeposition material, ability to dynamically align the removed materialvia an optical feed-back mechanism, such as a camera, the ability tomanufacture these margins in exceedingly thin sections, between 1 and100 microns, thus allowing for the optimization of energy density notattainable by other manufacturing means.

As illustrated in FIG. 3, the use of removal or ablation techniques,such as a laser, allows for the margin to be created and to preserve asolid layer edge to present to the termination operation but stillseparate the terminations of anode and cathode on, for example, eachside of the cell. In FIG. 3 above terminations made over the fullsurface of the cell edge depicted by item 91 results in contact to theanode and/or its associated current collector, and terminations madeover the full surface of the cell edge depicted by item 93 results incontact to the cathode and/or its associated current collector. As shownin FIG. 4, it is possible to retain all of the beneficial features ofthis invention with this embodiment including cutting individual stripsfrom the main strap, terminating them, and then cutting each strip intoindividual battery products.

Referring now to FIG. 5, we depict the strap of electrochemical cells asa cross-section in the cross machine direction. Here we illustrate asimilar layer structure to FIGS. 1 and 2 where item 51 is a cathodecurrent collector, item 53 is a cathode layer, item 55 is an electrolytelayer, item 57 is an anode layer and item 61 represents theleveling-smoothing layer of high etch ratio.

It will be noticed that four strips of electrochemical cells aredepicted, however, it is the intention of this invention to includemultiples of strips, both equal in width and different in width asexplained in detail above. The arrows are shown at the place wereseparation of the strips is performed. After separation, the individualelectrochemical strips would resemble FIG. 2, and after plasma orchemical etching and termination, FIG. 1; hence, these figures depictthe complete process of producing the strap of electrochemical devicescomposed of strips to be separated, and etched and terminated.

It is also contemplated by this invention that the bottom and top of thestrap may be preferentially coated or covered by a barrier layer; thusaffording a high degree of integrity to the then separatedelectrochemical cell.

It is further contemplated by this invention that the number ofalternate layers may be in other arrangements, including Cathode CurrentCollector, Cathode, Electrolyte, Anode, Cathode, Cathode CurrentCollector as a repeating MER.

It is further contemplated by this invention that the number ofalternate parallel electrochemical cells may be as few as one and asnumerous as several thousand.

Referring now to FIG. 5, depicting an electrochemical cell madeaccording to one embodiment of this invention. As described above forFIG. 1, the cell includes anode layers 21, cathode current collectorlayers 23, cathode layers 25, and electrolyte layers 27. In thisdepiction, the leveling—smoothing layers items 41 are shown prior toplasma etching. In this depiction it is shown how the thin layersneeding to be electrically connected in parallel are supported bycomplete embedding within the structure.

Turning now to FIG. 6, item 65 illustrates the strap of embeddedelectrochemical cells removed from the substrate transport device, i.e.drum, strap or sheet. Item 67 indicates the rows of stacked cells in themachine direction. Item 69 indicates the locations where the strap is tobe separated into sub-strips according to the present invention. By wayof illustration only, three sub-strips are depicted, but it isenvisioned by this invention that many sub-strips may be manufactured ina strap, and that different width sub-strips may be simultaneouslymanufactured. This, combined with the inherent ability to separate thesub-strips into different lengths, provides the ability to manufacturemany size and shapes of electrochemical devices in one step.

By way of example of one embodiment of the invention, FIG. 7 shows ascanning electron microscope image of the cross-section of multilayercells separated by polymer interlayers, deposited according to onemethod of the current invention. The layers as indicated in FIG. 7 arecomposed of:

-   1. Item 99 Cell 1 current collector;-   2. Item 101 Cell 1 cathode;-   3. Item 103 Cell 1 electrolyte;-   4. Item 105 Cell 1 anode;-   5. Item 107 Polymer interlayer;-   6. Item 109 Cell 2 current collector;-   7. Item 111 Cell 2 cathode;-   8. Item 113 Cell 2 electrolyte;-   9. Item 115 Cell 2 anode; and-   10. Item 117 Polymer interlayer.

As depicted in FIG. 8, the apparatus for manufacturing the presentinvention is illuminated. Although it has been described in U.S. Pat.No. 7,945,344 and U.S. Patent Publication Nos. 2009-0325063;2012-0058380; 2012-0055633; and 2012-0058280; and U.S. patentapplication Ser. No. 13/407,609, all assigned to Sakti3, Inc., which areincorporated by reference herein, we present this information to helpillustrate the fullness of the invention.

Turning to item 71, we see a vacuum chamber enclosing all of theprocessing equipment. For illustration purposes only, a rectangularchamber is shown, but also suitable and contemplated by this inventionare round, square, and other shapes, and multiple discrete chambersseparated by load locks. Contained within this processing chamber areseveral PVD deposition sources (item 75). Again, these depositionsources have been described in full in U.S. Pat. No. 7,945,344 and U.S.Patent Publication Nos. 2009-0325063; 2012-0058380; 2012-0055633; and2012-0058280; and U.S. patent application Ser. No. 13/407,609, allassigned to Sakti3, Inc., which are incorporated by herein and are usedfor illustrative purposes as other deposition devices and arrangementsare contemplated by this invention.

Item 73 illustrates a revolving belt upon which the present invention ismanufactured. Again, by way of illustration, a roll-to-roll arrangement,a rotating drum, or a linear movement of plates of substrates may besubstituted. The belt is shown in a horizontal configuration, but againby way of illustration the drum or sheet or plate may be horizontal orvertical or any angle that is required to optimize the manufacturing ofthe present invention. Finally, item 77 depicts the evaporation andenergy curing of the substantially acrylated organic monomer integral tothis invention. Here we see this item mounted to the left side of thebelt substrate transport device, but in full contemplation of thisinvention other locations may be more advantageous.

It can be seen how the application of the evaporated organic monomer isdirected and condensed on the substrate transport. Control of thesubstrate temperature is a key process parameter of this invention withtemperatures between about 3 degrees C. and 17 degrees C. most useful.High performance di- and tri-acrylate monomers or a mixture of the sameare atomized in an ultrasonic nozzle and evaporated and condensed on thesubstrate. By way of example, the monomer or mixture of monomers mayinclude tripropylene glycol diacrylate, trimethylolpropane triacrylate,dodecanediol dimethacrylate. The mixture may also include initiators forcuring of the condensed material. Curing can be achieved by a number ofmeans including but not limited to electron beam, ion beam, UV, xenonlamp, or thermal treatment.

So finally, it can be fully understood and envisioned that thisinvention is unique and non-intuitive for the manufacturing of thin filmsolid-state battery cells and devices. By rotating the belt, in thisinstance, various layers may be simultaneously deposited through anumber of masks to deposit delineated strips of electrochemical thinfilm layers. Upon condensation and cross linking of the organic monomer,these strips of layers are planarized and embedded into a solid matrixof organic and inorganic materials of certain thicknesses and in certainpositions. The process may simply be continued, or repeated, until thenecessary number of device cells or layers is deposited.

As detailed above, later process steps outside or inside of the sameprocess chamber, or chambers is used to separate, preferentially etch,or remove a portion of the embedded organic polymer exposing theintegrated anode and cathode current collectors, allowing for a PVDtermination layer or layers to be applied. Additional steps outside thechamber may include additional processes using the same or similaressentially acrylate polymer for further enclosing or stacking thestacks of layered cells. This process may require different monomermixtures or curing processes due to the change in environment. Thuscompleting the battery device and making it ready for testing, packagingand sale.

Conventional practice does not address these needs or unique solutionsin multilayer solid-state batteries. Therefore presented below is anEncapsulated Solid-State Battery and Method of Manufacture.

-   1. Deposit with a single, continuous vacuum process, a strap or    substrate containing all layers necessary for a useful and valuable    solid-state battery suitable for replacement of existing battery    technology. This deposition may contain any combination of masking    or removal to achieve delineation of individual layers.-   2. Remove the strap from the vacuum coater.-   3. Cut the strap into strips.-   4. Terminate the strips by any number of means including: etching    back of insulating materials, plating, shooping, vacuum depositing,    metal spraying, dipping, roller coating, and the like with a    conductive material.-   5. Cut the strips into individual batteries.-   6. Add electrically conductive leads.-   7. If required, stack and combine the cells in a series or parallel    to obtain the required voltage or current capability and then    package the battery by any number of means including: sealing into a    pouch, metal package, plastic package or other pre-formed enclosure,    dipping, spraying, or otherwise coating in a suitable liquid    compound, then curing or hardening the compound.-   8. Using as a finished battery product.

A method for manufacturing a battery device is outlined as follows,referring also to method 900 of FIG. 9.

1. (step 902) Start;

2. (step 904) Form using at least a process chamber, a plurality offirst strip regions overlying a surface region of a substrate membercoupled to a transfer device, the transfer device being selected from atleast one of a drum device, a roll-to-roll device, a plate device or abelt device, each of the first strip regions comprising a stack of thinfilm electrochemical devices, each of the thin film electrochemicaldevices comprising at least an anode material, a cathode material, andan electrolyte material, the plurality of first strip regions beingconfigured in a first direction along a length of the surface region ofthe substrate and being normal to a second direction, the seconddirection being normal to the first direction;

3. (step 906) Form a first gap region associated with each of theplurality of strip regions using a removal process, each of theplurality of first strip regions having a first thickness above thesurface region, the removal process being selected from one of a shadowmasking removal or ablation process or a laser ablation process to causeformation of a plurality of strips configured with the plurality offirst gap regions, each of which is separating a pair of strips;

4. (step 908) Form a fill material overlying the plurality of firststrips and plurality of first gap regions to substantially fill each ofthe first gap regions and substantially enclose each of the plurality offirst strips and forming a planarized first upper surface regionoverlying the plurality of strips;

5. (step 910) Successively repeat the process of forming the pluralityof strip regions, the plurality of gap regions, and forming the fillmaterial overlying the planarized first upper surface region N times,where N is an integer greater than two (2) to form multiple plurality ofstrips configured as a vertical stack structure enclosed in the fillmaterial overlying the substrate member;

6. (step 912) Remove the substrate member including the vertical stackstructure including the multiple plurality of strips from the transferdevice, while maintaining the substrate member having the multipleplurality of strips intact and enclosed in fill material;

7. (step 914) Selectively separate one or more of the plurality ofstrips to form an encapsulated portion of one of the multiple stripsenclosed in fill material;

8. (step 916) Expose a first conductor from a first side of theencapsulating portion of one of the multiple strips and exposing asecond conductor from a second side of the encapsulating portion of oneof the multiple strips;

9. (step 918) Form a first electrode member electrically andmechanically coupled to the first conductor and forming a secondelectrode member electrically and mechanically coupled to the secondconductor; and

10. (step 920) Provide a discrete battery device.

As shown, the present method includes one or more of the above sequenceof processes. Variations to the processes also exist. For example, theforming of the first electrode member and the second electrode memberare provided by at least one of vacuum deposition, plating, thermalspraying, dipping, coating, air or airless spraying or brushing. Thefill material for the first planarized upper surface region comprises anacrylated monomer or mixture of a plurality of monomers and curinginitiators with a viscosity measured in cps at 20 degrees Celsiusbetween about 0.6 and 600. The fill material is characterized as anelectrical insulator deposited by at least one of PVD, CVD, PECVD, flashevaporation, thermal evaporation, electron beam evaporation, RF or DC orpulsed DC or mid frequency magnetron sputtering, or high power pulsedmagnetron sputtering HPPMS. The exposing comprises an etching process,the etching process being at least one of a liquid etchant toselectively etch an anode current collector or a cathode collector or aplasma or plasma with ion assist including at least one background gas,the background gas being at least one of Argon, Oxygen, Nitrogen,Helium, CF₆, CF₄, CH₄, SF₆, H, and/or combinations thereof.

In an example, the separating process uses at least one of a diamondsaw, diamond wire saw, carbide saw, tool steel saw, water jet, laser,ultrasonics, knife blades, scoring, breaking, punching, shearing, heat,cryogenics, etching and their combinations. In an example, any of theabove steps, and others described herein, further include attaching anactive or passive electrical device to the discrete battery device, theelectrical device being at least one of a pin or socket, electricalenergy transmission device, parallel or serial data transmission device,LED, fluorescent lamp, incandescent lamp, electroluminescence lamp,digital display, analogue display, sound producing device, vibrationproducing device, digital memory device, solar cell, heat producingdevice, thermistor or thermocouple, pressure sensing device, humiditysensing device, magnetism sensing device, acceleration sensing device,gravity sensing device, pH sensing device, blood sugar sensing device,odor sensing device, optical sensing device, x-ray sensing device, gammaray sensing device, electric charge sensing device, MEMS based device,monolithic silicon analogue or digital device, energy management device,diode, transistor, resistor, capacitor, inductor, antenna, or RFIDdevice.

In an example, the first electrode member and the second electrodemember are made using a conductive material from as least one ofChromium, Nickel, Monel, Titanium, Silver, Gold, Aluminum, Copper, Zinc,Tantalum, Tin, Iridium, Palladium, Tantalum, or their alloys, andnitrides. The conductive material is provided using at least one ofelectroplating, electroless plating, PVD, CVD, Plasma assisted CVD,sputtering, bias sputtering, ion assisted deposition, arc deposition,flame and plasma spraying, dipping, painting, ink jet printing, rollcoating, or combinations thereof. The first electrode member and thesecond electrode member are characterized by an adhesion factor to thefirst conductor and the second conductor, the adhesion factor beinggreater than 0.05 pounds per square inch. Each of the first conductorand the second conductor has greater thickness region within a vicinityof a termination with the first electrode member or the second electrodemember.

In an example, one or more of the plurality of strips are configuredwith one or more different widths and/or lengths to form one or moredifferent discrete battery devices. The plurality of strip regions ischaracterized by greater than 1000 strips in parallel arrangement.

Additionally, the method can also provide at least one functionenhancement region configured between any pair of strips or between anyone of the strips and the surface region or overlying an upper stripregion or covering a entire three-dimensional shape of the one or morestrips. As an example, the function enhancement region being provided:

to increase resistance to environmental degradation;

to decrease lithium diffusion;

to increase resistance to scratching;

to increase resistance to solvents;

to enhance printing ink adhesion;

to provide color;

to provide gloss;

to provide reduced odor transmission;

to provide thermal protection;

to enhance thermal transfer;

to help constrain expansion;

to provide a gettering function to moisture;

to provide a gettering function to oxygen;

to provide a gettering function to nitrogen;

to enhance tolerance to thermal shock;

to enhance resistance to or transmission of EMI interference;

to minimize stress;

to provide temporary adhesion for improvement of secondary manufacturingsteps;

to increase the frictional coefficient of the outer layer to increaseease of handling in assembly, packaging and use;

to provide a removable protective layer to temporarily increaseprotection during storage, handling or WIP;

to provide temporary electrical insulation of the battery deviceterminals; or

to provide adhesion of one stack of battery devices to another stack ofbattery devices or to a package in a separate down stream process, andany combinations of the above.

In an example, the function enhancement region composed of at least oneof PCTFE, PVdC, epoxy compound, silicone compound, acrylate compound,urethane compound, BUNA, cellulose compound, block co-polymers, PET,PEN, PE, HDPE, UMWPE, enamel compound, SiOx, Al2O3, SiOxNx, TiNx, TaNx,TaOx, glyptol, mica, Mylar, natural rubber compound, or neoprenecompound, or combinations thereof, and the like.

In various embodiments, the method can include a method for themanufacture of a solid-state electrochemical device using at least ahigh speed evaporation process. The method can include using a computedand engineered set of spatial dimensions for each layer thicknessmeasured out of plane, for margins, measured in plane between dissimilarconductors and a termination, and for the termination layers where eachdimension is optimized for energy density of the electrochemical cell.The margin can be between about 5 and 100 microns, where the layerthicknesses are between about 0.01 and 25 microns. The energy capacitycan be between 150 mAh and 50 Ah or the energy density is greater than600 Wh/L. The engineered set of spatial dimensions may be described inone or more of the following, including U.S. Pat. No. 7,945,344 and U.S.Patent Publication Nos. 2009-0325063; 2012-0058380; 2012-0055633; and2012-0058280; and U.S. patent application Ser. No. 13/407,609, each ofwhich is incorporated by reference, and all assigned to Sakti3, Inc.

In various embodiments, the method can include forming multiple thinlayers of solid-state materials comprising an electrochemical cellresilient in bending and substantially environmentally protected from anambient factory environment. The forming of the multiple thin layers ofsolid state materials can be further processed in the factoryenvironment free from an exterior packaging designed to maintain themultiple thin layers of solid state materials free from contaminants.The multiple thin film layers of solid state materials can be shaped toconform to fit within an individual packaging to increase an energydensity for an end use product or a completed electrochemical cell oralternatively forming the multiple thin layers of solid state materialsdirectly onto a package of a consumer device or industrial device, theconsumer device or the industrial device being one of a cell phone,computer tablet, laptop PC, or automobile. The completed electrochemicalcell has a moisture ingress rate of less than 3×10⁻⁴ gm/m²/day.

While the above is a full description of the specific embodiments,various modifications, alternative constructions and equivalents may beused. Therefore, the above description and illustrations should not betaken as limiting the scope of the present invention which is defined bythe appended claims.

1. (canceled)
 2. A method for manufacturing of a solid-state batterydevice, the method comprising: forming a plurality of stacks of thinfilm battery devices overlying a substrate coupled to a roll-to-rolldevice, each of the stacks having a first thickness above the substrate,each of the thin film battery devices comprising an anode material, acathode material, and a solid state electrolyte material, the stacksbeing configured in a first direction along a length of the substrate,and the stacks being normal to a second direction; forming a first gapregion associated with each of the plurality of stacks using a laserablation removal process, the first gap region separating adjacentstacks; providing a fill material overlying the plurality of stacks andfilling the first gap regions; the fill material enclosing the pluralityof stacks and planarizing the surface region of the plurality of stacksto provide a first upper surface; repeating the forming process toprovide a further plurality of stacks of thin film battery deviceshaving a plurality of gap regions with fill material, such that thefurther plurality of stacks overlie the first upper surface, the formingprocess being repeated to provide a vertical stack structure;selectively separating one or more of the plurality of stacks in thevertical stack structure to form an encapsulated portion of one of theplurality of stacks enclosed in the fill material; exposing a firstconductor to a first side of the encapsulating portion and exposing asecond conductor to a second side of the encapsulating portion.
 3. Themethod of claim 2, wherein a first and second electrode are formed onthe first and second conductor respectively via vacuum deposition,plating, thermal spraying, dipping, coating, air or airlessspraying/brushing.
 4. The method of claim 2, wherein the fill materialfor the first planarized upper surface region comprises an acrylatedmonomer or mixture of a plurality of monomers and curing initiators witha viscosity measured in cps at 20 degrees Celsius between about 0.6 and600.
 5. The method of claim 2, wherein the exposing step is an etchingprocess, the etching process being at least one of a liquid etchant toselectively etch an anode current collector or a cathode collector or aplasma or plasma with ion assist including at least one background gas,the background gas being at least one of Argon, Oxygen, Nitrogen,Helium, CF₆, CF₄, CH₄, SF₆, H, and/or combinations thereof.
 6. Themethod of claim 2, wherein the plurality of stacks comprises greaterthan 1000 thin film battery devices connected in a parallel arrangement.7. The method of claim 2, wherein the fill material is an electricalinsulator deposited by at least one of PVD, CVD, PECVD, flashevaporation, thermal evaporation, electron beam evaporation, RF or DC orpulsed DC or mid frequency magnetron sputtering, or high power pulsedmagnetron sputtering HPPMS.
 8. The method of claim 3, wherein the firstand second electrodes are made using a conductive material from as leastone of Chromium, Nickel, Monel, Titanium, Silver, Gold, Aluminum,Copper, Zinc, Tantalum, Tin, Iridium, Palladium, Tantalum, or theiralloys, and nitrides, the conductive material being provided using atleast one of electroplating, electroless plating, PVD, CVD, Plasmaassisted CVD, sputtering, bias sputtering, ion assisted deposition, arcdeposition, flame and plasma spraying, dipping, painting, ink jetprinting, roll coating, or combinations thereof.
 9. The method of claim3, wherein the first and second electrode member are characterized by anadhesion factor to the first conductor and the second conductorrespectively, the adhesion factor being greater than 0.05 pounds persquare inch.
 10. The method of claim 3, wherein each of the firstconductor and the second conductor has greater thickness region within avicinity of a termination with the first electrode member or the secondelectrode member.
 11. The method of claim 2, wherein one or more of theplurality of stacks are configured with one or more different widths orlengths to form one or more different discrete battery devices overlyingthe substrate.
 12. The method of claim 2, further comprising providing afunction enhancement region in the solid-state battery device, thefunction enhancement region being provided: to increase resistance toenvironmental degradation; to decrease lithium diffusion; to increaseresistance to scratching; to increase resistance to solvents; to enhanceprinting ink adhesion; to provide color; to provide gloss; to providereduced odor transmission; to provide thermal protection; to enhancethermal transfer; to help constrain expansion; to provide a getteringfunction to moisture; to provide a gettering function to oxygen; toprovide a gettering function to nitrogen; to enhance tolerance tothermal shock; to enhance resistance to or transmission of EMIinterference; to minimize stress; to provide temporary adhesion forimprovement of secondary manufacturing steps; to increase the frictionalcoefficient of the outer layer to increase ease of handling in assembly,packaging and use; to provide a removable protective layer totemporarily increase protection during storage, handling or WIP; toprovide temporary electrical insulation of the battery device terminals;or to provide adhesion of one stack of battery devices to another stackof battery devices or to a package in a separate downstream process.